Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy
MA Matin, EWC Coenen, WP Vellinga, MGD Geers - Scripta Materialia, 2005 - Elsevier
MA Matin, EWC Coenen, WP Vellinga, MGD Geers
Scripta Materialia, 2005•ElsevierIntrinsic thermal fatigue in a mechanically unconstrained Pb-free, Sn-rich Sn–3.8 Ag–0.7 Cu
alloy has been investigated under cyclic thermal loading between 293K and 353K. Fatigue
damage is shown to occur preferentially along high angle grain boundaries. From a
combination of orientation imaging microscopy and finite element modelling it appears that
this fatigue damage and stresses resulting from the thermal anisotropy of Sn are highly
correlated.
alloy has been investigated under cyclic thermal loading between 293K and 353K. Fatigue
damage is shown to occur preferentially along high angle grain boundaries. From a
combination of orientation imaging microscopy and finite element modelling it appears that
this fatigue damage and stresses resulting from the thermal anisotropy of Sn are highly
correlated.
Intrinsic thermal fatigue in a mechanically unconstrained Pb-free, Sn-rich Sn–3.8Ag–0.7Cu alloy has been investigated under cyclic thermal loading between 293K and 353K. Fatigue damage is shown to occur preferentially along high angle grain boundaries. From a combination of orientation imaging microscopy and finite element modelling it appears that this fatigue damage and stresses resulting from the thermal anisotropy of Sn are highly correlated.
Elsevier
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