Corrosion behavior and failure mechanism of ball grid array packages in fire smoke atmospheres
M Zhao, JR Feng, Q Li, S Lu, J Lin - Engineering Failure Analysis, 2024 - Elsevier
Ball grid array (BGA) packages is a common type of electronic packaging and a crucial
component in electronic devices. However, its reliability is significantly compromised when
exposed to fire smoke atmospheres, thereby reducing the overall reliability of electronic
equipment. Therefore, the study of failure mechanisms of BGA packages in fire smoke
environments is of paramount importance for the recovery and maintenance of electronic
devices post-fire. In this study, we conducted fire smoke experiments and employed …
component in electronic devices. However, its reliability is significantly compromised when
exposed to fire smoke atmospheres, thereby reducing the overall reliability of electronic
equipment. Therefore, the study of failure mechanisms of BGA packages in fire smoke
environments is of paramount importance for the recovery and maintenance of electronic
devices post-fire. In this study, we conducted fire smoke experiments and employed …
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