interface reaction between In-based solder materials and the Cu substrate. The liquidus
surface, invariant equilibria and four vertical sections of the Cu–In–Sb ternary system were
calculated by the CALPHAD method using binary thermodynamic parameters included in
the COST531 database. Alloys, representing two isopleths from indium corner with molar
ratio of copper and antimony equal to 1/3 and 1/1 and two isopleths from antimony corner …