performed to investigate the fatigue curve of microscale single-crystal copper specimens
with a test part of 1× 1× 2 μm under various strain amplitudes. The variation of resolved
shear stress on the primary slip plane (τ B4) and the corresponding evolution of
crystallographic slips in each cycle are analyzed and in situ observed, respectively. The
variation of τ B4 during fatigue shows that,(i) the variation of τ B4 clearly includes the early …