Silicon die surface temperature can be used to monitor the health state of digital and
analogue integrated circuits (IC). In the present paper, four different sensing techniques:
scanning thermal microscope, laser reflectometer, laser interferometer and electronic built-in
differential temperature sensors are used to measure the temperature at the surface of the
same IC containing heat sources (hot spots) that behave as faulty digital gates. The goal of
the paper is to describe the techniques as well as to present the performances of these …