This book is the product of a developing research focus on CMP at Berkeley. Its focus is on
the important area of process models which have not kept pace with the tremendous
expansion of applications of CMP. It specifically deals with the development of models with
sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to
assess impact on quality or quantity of production. The important role of the mechanical
elements of the process are included in such an" integrated model". The objective of the …

Chemical mechanical planarization, or chemical mechanical polishing as it is
simultaneously referred to, has emerged as one of the critical processes in semiconductor
manufacturing and in the production of other related products and devices, MEMS for
example. Since its introduction some 15+ years ago CMP, as it is commonly called, has
moved steadily into new and challenging areas of semiconductor fabrication. Demands on it
for consistent, efficient and cost-effective processing have been steady. This has continued …