[HTML][HTML] Interconnect patterns for printed organic thermoelectric devices with large fill factors
Organic materials can be printed into thermoelectric (TE) devices for low temperature energy
harvesting applications. The output voltage of printed devices is often limited by (i) small
temperature differences across the active materials attributed to small leg lengths and (ii) the
lower Seebeck coefficient of organic materials compared to their inorganic counterparts. To
increase the voltage, a large number of p-and n-type leg pairs is required for organic TEs;
this, however, results in an increased interconnect resistance, which then limits the device …
harvesting applications. The output voltage of printed devices is often limited by (i) small
temperature differences across the active materials attributed to small leg lengths and (ii) the
lower Seebeck coefficient of organic materials compared to their inorganic counterparts. To
increase the voltage, a large number of p-and n-type leg pairs is required for organic TEs;
this, however, results in an increased interconnect resistance, which then limits the device …
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