Investigation of barrier and slurry effects on the galvanic corrosion of copper
D Ernur, S Kondo, D Shamiryan, K Maex - Microelectronic Engineering, 2002 - Elsevier
Galvanic corrosion of copper as a function of barrier metal type together with the effect of
acid type is investigated. Refractory metals such as Ta, Ti, and W are used as the barrier
metals. HNO3-based and H2O2-based aqueous solutions are used to analyze the effect of
acid type of the CMP slurry on the galvanic corrosion. The results show that the galvanic
etch rate of copper is affected by the barrier metal type. In addition, the type of solution used
is found to influence the barrier metal as well as the copper. Especially for the case of W, the …
acid type is investigated. Refractory metals such as Ta, Ti, and W are used as the barrier
metals. HNO3-based and H2O2-based aqueous solutions are used to analyze the effect of
acid type of the CMP slurry on the galvanic corrosion. The results show that the galvanic
etch rate of copper is affected by the barrier metal type. In addition, the type of solution used
is found to influence the barrier metal as well as the copper. Especially for the case of W, the …
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