Investigation of various board-level underfills and adhesives for CTBGA bend performance enhancements in lead-free portable electronic products
H Shi, T Ueda - … on Electronic Packaging Technology and High …, 2011 - ieeexplore.ieee.org
This paper discusses the influences of various underfills and adhesives on board-level bend
performance of ChipArray® Thin Core Ball Grid Array (CTBGA) assemblies through an the
monotonic three-point bending test. It is found that the bonding materials do enhance the
bend performance for all the test categories as compared with the control assemblies which
are without bonding materials, but the degrees of improvements between different strategies
vary quiet a lot. The specific bend strength is affected by a number of factors, in which …
performance of ChipArray® Thin Core Ball Grid Array (CTBGA) assemblies through an the
monotonic three-point bending test. It is found that the bonding materials do enhance the
bend performance for all the test categories as compared with the control assemblies which
are without bonding materials, but the degrees of improvements between different strategies
vary quiet a lot. The specific bend strength is affected by a number of factors, in which …
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