A Review of Die-to-Die, Die-to-Substrate and Die-to-Wafer Heterogeneous Integration
… bonding pitch) and an increase in number of wiring layers per … involves metal to metal contact,
with no dielectric bonding. … to continuing the scaling of microelectronics that has driven the …
with no dielectric bonding. … to continuing the scaling of microelectronics that has driven the …
Low-temperature Solid-state Bonding of Micro-bumps Arrays with Flat-to-Convex Structure via Plasma-induced Silver Oxide Nanoparticles
T Wang, S Gu, S Liu, X Xie, S Zhao… - … and Manufacturing …, 2025 - ieeexplore.ieee.org
… mechanical strength, metal-tometal direct bonding technology is … wafers, as well as a 3000
nm layer of Ag on an 8-inch Cu … integrity and electrical performance of microelectronic compo…
nm layer of Ag on an 8-inch Cu … integrity and electrical performance of microelectronic compo…
Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging
T Suga, R He, G Vakanas, A La Manna - 3D Microelectronic Packaging …, 2017 - Springer
… methods of low-temperature Cu–Cu bonding including: (a) … can enable bonding of various
materials (metal-to-metal, … is defined as two layer structures bonded directly with metallic …
materials (metal-to-metal, … is defined as two layer structures bonded directly with metallic …
Effect of ultrathin palladium layer in achieving a low temperature and pressure wafer level aluminum to aluminum bonding
HK Cheemalamarri, S Bonam… - Surface Topography …, 2020 - iopscience.iop.org
… the top of the metal pillar to a wafer-level direct metal to metal interconnects using metal
diffused … Also, we observed the surface structural and morphological changes that occurred after …
diffused … Also, we observed the surface structural and morphological changes that occurred after …
Advanced Metallization Processes for Complex Structures in Microelectronics by Direct-Liquid-Evaporation Chemical Vapor Deposition
J Feng - 2017 - search.proquest.com
… layer, while a higher temperature with higher flow rate is favorable for larger-scale coatings
such as intermediate and global interconnects in 3D microelectronics.… strong metal-to-metal …
such as intermediate and global interconnects in 3D microelectronics.… strong metal-to-metal …
Characterization and Application of a Novel Permanent Bonding Material
R Sejoubsari, X Liu, T Stanley - 2020 IEEE 70th Electronic …, 2020 - ieeexplore.ieee.org
… metal-to-metal, ultrasonic, and adhesive bonding techniques. … a polymeric intermediate
layer to create a bond between two … are commonly used methods to serve the microelectronic …
layer to create a bond between two … are commonly used methods to serve the microelectronic …
Interdiffusion Mechanism and Thermal Conductance at the Interfaces in Low-Temperature Cu-to-Cu Bonds Achieved by Coating Nanolayers
X Jiang, Z Tao, Y Li, F Sun, D Yu, Y Zhong - Available at SSRN 4627642 - papers.ssrn.com
… was employed to investigate the surface and bonding structure. For characterizing the …
resistance due to direct metal-to-metal contact and the adoption of thin metallic layers, significantly …
resistance due to direct metal-to-metal contact and the adoption of thin metallic layers, significantly …
Development of hybrid bonding using area-selective passivation layer deposition technology on various substrates for heterogeneous integrated structure
WT Tsai, MP Hsu, YH Chen, YL Liu… - Japanese Journal of …, 2024 - iopscience.iop.org
… the deposition of passivation layers, with successful bonding observed at temperatures
ranging from 250 C … Hybrid bonding combines metal-to-metal bonding and dielectric-to-dielectric …
ranging from 250 C … Hybrid bonding combines metal-to-metal bonding and dielectric-to-dielectric …
Direct Cu to Cu bonding and alternative bonding techniques in 3D packaging
… of methods of low-temperature Cu–Cu bonding including: (a) … can enable bonding of various
materials (metal-to-metal, … is defined as two layer structures bonded directly with metallic …
materials (metal-to-metal, … is defined as two layer structures bonded directly with metallic …
Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications
Y Li, CP Wong - Materials Science and Engineering: R: Reports, 2006 - Elsevier
… , because it melts at a relatively low temperature (232 C), … layer tape that has no bond layer,
micropitch connection and fold finishing by inner-lead bonding (ILB) or outer-lead bonding …
micropitch connection and fold finishing by inner-lead bonding (ILB) or outer-lead bonding …