Low Temperature Processing of Electro-Ceramic Materials and Devices
D Wang - 2020 - search.proquest.com
2020•search.proquest.com
… It was found that the cold sintering process can suppress microcracking in the PZT layer,
presumably by strengthening the ceramic compact at low temperatures. Constrained
sintering was observed when PZT was cold sintered on Ni or Cu foils; these could be
avoided by laminating tape cast PZT and Cu powder instead. However, the Cu2O interface
formed between PZT and Cu is still problematic. The relative permittivity of the 800 C
annealed PZT on Cu is only ~500, with an -e31,f less than 5 C/m2. … This work explores …
presumably by strengthening the ceramic compact at low temperatures. Constrained
sintering was observed when PZT was cold sintered on Ni or Cu foils; these could be
avoided by laminating tape cast PZT and Cu powder instead. However, the Cu2O interface
formed between PZT and Cu is still problematic. The relative permittivity of the 800 C
annealed PZT on Cu is only ~500, with an -e31,f less than 5 C/m2. … This work explores …
Abstract
The dissertation investigated two low temperature processing methods: Applying deep ultra-violet (DUV) radiation during the sol-gel deposition of Bi 3 NbO 7 (BNO) thin films to facilitate carbon removal, and the cold sintering process (CSP) of Pb (Zr, Ti) O 3 (PZT) powder/tape.
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