The microelectronic manufacturing industry has been seeking improved efficiencies and faster fabrication turn-around for decades. The demand for better thermal management has been increasing in recent years and better materials and new processing techniques have been emphasized. LTCC technology has demonstrated great potential for satisfying most performance, cost and processing requirements. A novel approach for LTCC is micro-dispense direct printing which can print a wide range of materials to include a variety of screen printable thick film conductors, thick film resistors, dielectric materials and solder. Those with experience in micro-dispensing recognize the size limitation using a dispensing approach and understand that the hope of achieving smaller line widths, smaller pad sizes, and precise placement of the material is challenging. nScrypt has demonstrated the ability to build a complete branching micro-channel structure using a micro-dispensing LTCC approach. nScrypt has also demonstrated how the 3D capability and ability to handle materials compatible with LTCC will rival traditional screen printing and other maskless technologies, thus making this a viable manufacturing tool for many applications in microsystems and packaging.