With a view to the series production of one hundred, 12 m long XFEL 1.3 GHz cryomodules and their transportation from the assembly site at CEA Saclay (F) to the installation site at DESY Hamburg (D) a test transportation of a FLASH cryomodule has been performed, in the condition foreseen for the mass transportation. The present study examines the stresses induced on the module and verifies the damping capabilities of the transport frame in order to minimize risk of damage to the most critical components. During the transportation, acceleration and vibration have been monitored as well as coupler antenna contacts and vacuum performances. This paper describes the analysis performed and compares those results to the data of a similar transportation study at Fermilab for the CM1 cryomodule.