Niobium flex cable for low temperature high density interconnects
HJ Van Weers, G Kunkel, MA Lindeman, M Leeman - Cryogenics, 2013 - Elsevier
This work describes the fabrication and characterization of a Niobium on polyimide flex
cable suitable for sub-Kelvin temperatures. The processing used can be extended to high
density interconnects and allows for direct integration with printed circuit boards. Several key
parameters such as RRR, Tc, current carrying capability at 4K and thermal conductivity in
the range from 0.15 to 10K have been measured. The average Tc was found to be 8.9 K,
with a minimum of 8.3 K. Several samples allowed for more than 50mA current at 4K while …
cable suitable for sub-Kelvin temperatures. The processing used can be extended to high
density interconnects and allows for direct integration with printed circuit boards. Several key
parameters such as RRR, Tc, current carrying capability at 4K and thermal conductivity in
the range from 0.15 to 10K have been measured. The average Tc was found to be 8.9 K,
with a minimum of 8.3 K. Several samples allowed for more than 50mA current at 4K while …
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