Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and In
Cu 6 Sn 5 is a critical intermetallic compound in future three-dimensional integrated circuit
(3D IC) in micro-electronic packaging and has different crystal structures in the solid state.
This paper investigates the effect of Zn, Au and In on the phase stability and thermal
expansion behavior of Cu 6 Sn 5 intermetallics over the temperature range of− 80° C to 240°
C, using in-situ variable temperature synchrotron powder X-ray diffraction (PXRD),
dilatometry and first principles calculations. The results show Zn, Au and In stabilize the …
(3D IC) in micro-electronic packaging and has different crystal structures in the solid state.
This paper investigates the effect of Zn, Au and In on the phase stability and thermal
expansion behavior of Cu 6 Sn 5 intermetallics over the temperature range of− 80° C to 240°
C, using in-situ variable temperature synchrotron powder X-ray diffraction (PXRD),
dilatometry and first principles calculations. The results show Zn, Au and In stabilize the …
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