successfully prepared on n-Si (100) by chemical solution deposition (CSD) using bismuth
nitrate and titanium butoxide as starting materials. The structural properties were studied by
X-ray diffraction. The dielectric constant at 100 kHz at room temperature was 118 and loss
factor was 0.074, for a 0.4-μm-thick film annealed at 500° C for 30 min. The leakage current
density was 4.06× 10− 7 A/cm2 at an applied voltage of 15 V.