switching characteristics of HfO x based RRAM. Elimination of parasitics in 50nm× 50nm
cross-bar 1T1R devices (C p<; 50fF) integrated on 300mm wafers using fab-friendly TiN
electrodes enabled superior control of high and low resistance of a conductive filament (CF).
Sub 50fF parasitics also critically enable a pulsed forming method compatible with high
volume manufacturing (HVM). A novel assessment of RRAM operation trade-offs is also …