A new technique for producing thin single-crystal silicon solar cells has been developed. The new technology allows for large decreases in silicon usage by a factor of 12 (including kerf losses) compared to conventional crystalline silicon wafer technologies. The new Sliver^® cell process uses a micromachining technique to form 60μm-thick solar cells, fully processed while they are still supported by the silicon substrate at the edge of the wafer. The Sliver^® solar cells are capable of excellent performance due to their thickness and unique cell design with demonstrated efficiencies over 19.3% and open-circuit voltages of 683mV. In addition, the cells are bifacial (accepts light from either sides) and very flexible. Several prototype modules have been fabricated using a new design approach that introduces a diffuse reflector to the rear of a bi-glass module. To save expensive silicon material, a significant gap is kept between cells. The light striking between cells is scattered from the rear reflector and is directed onto the rear surface of the bifacial Sliver^® cells. Module efficiency of 13% (AM1.5, 25C) has been demonstrated with a module presenting a 50% solar-cell coverage fraction, and 18.3% with a 100% Sliver^® cell coverage fraction.