Mesoporous silica (MPS) thin films are attractive for electrically isolating Cu wiring in
nanodevices. While porosity is conducive for realizing low-dielectric permittivity k necessary
for low signal propagation delays, it renders the MPS susceptible to moisture uptake and
metal diffusion. Here, we show that passivating MPS with more than one organosilane with
different molecular termini provides several fold greater protection against such instabilities
than improvements observed by functionalizing MPS with either type of organosilane …