Stress field modeling of single-abrasive scratching of BK7 glass for surface integrity evaluation

W Hu, Q Teng, T Hong, V Saetang, H Qi - Ceramics International, 2022 - Elsevier
W Hu, Q Teng, T Hong, V Saetang, H Qi
Ceramics International, 2022Elsevier
This paper presents a numerical and experimental study on the single-abrasive scratching
of BK7 glass. The formation mechanisms of cracks are investigated for surface integrity
evaluation to improve the processing efficiency and ensure surface quality through the
inhibition of surface and subsurface damage. The numerical simulation reveals that as the
abrasive gradually scratches the target surface, median cracks nucleate at the current
position just beneath the abrasive, while symmetrical radial cracks that propagate along the …
Abstract
This paper presents a numerical and experimental study on the single-abrasive scratching of BK7 glass. The formation mechanisms of cracks are investigated for surface integrity evaluation to improve the processing efficiency and ensure surface quality through the inhibition of surface and subsurface damage. The numerical simulation reveals that as the abrasive gradually scratches the target surface, median cracks nucleate at the current position just beneath the abrasive, while symmetrical radial cracks that propagate along the negative direction of the x-axis along the scratching direction are easily nucleated slightly behind the abrasive. The single-abrasive scratching experiments at gradually increasing depths on BK7 glass indicate that as the scratching speed increases, the plastic machinability and machining quality are significantly improved. The predicted nucleation position and propagation direction of the radial cracks on the target surface agree well with the corresponding experimental results. Thus, this study can provide a reference for the actual fabrication of high-value BK7 glass devices with high efficiency and quality.
Elsevier
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