Structure and kinetics of Sn whisker growth on Pb-free solder finish
WJ Choi, TY Lee, KN Tu, N Tamura… - … 2002.(Cat. No …, 2002 - ieeexplore.ieee.org
Standard leadframes used in surface mount technology are finished with a layer of eutectic
SnPb for passivation and for enhancing solder wetting during reflow. When eutectic SnPb is
replaced by Pb-free solder, especially the eutectic SnCu, a large number of Sn whiskers are
found on the Pb-free finish. Some of the whiskers are long enough to become shorts
between the neighboring legs of the leadframe. How to suppress their growth and how to
perform accelerated test of Sn whisker growth are crucial reliability issues in the electronic …
SnPb for passivation and for enhancing solder wetting during reflow. When eutectic SnPb is
replaced by Pb-free solder, especially the eutectic SnCu, a large number of Sn whiskers are
found on the Pb-free finish. Some of the whiskers are long enough to become shorts
between the neighboring legs of the leadframe. How to suppress their growth and how to
perform accelerated test of Sn whisker growth are crucial reliability issues in the electronic …
[PDF][PDF] Structure and kinetics of Sn whisker growth on Pb-free solder
WJ Choi, TY Lee, KN Tu - 2002 - academia.edu
Standard leadframes used in surface mount technology are finished with a layer of eutectic
SnPb for passivation and for enhancing solder wetting during reflow. When eutectic SnPb is
replaced by Pb-free solder, especially the eutectic SnCu, a large number of Sn whiskers are
found on the Pb-free finish. Some of the whiskers are long enough to become shorts
between the neighboring legs of the leadframe. How to suppress their growth and how to
perform accelerated test of Sn whisker growth are crucial reliability issues in the electronic …
SnPb for passivation and for enhancing solder wetting during reflow. When eutectic SnPb is
replaced by Pb-free solder, especially the eutectic SnCu, a large number of Sn whiskers are
found on the Pb-free finish. Some of the whiskers are long enough to become shorts
between the neighboring legs of the leadframe. How to suppress their growth and how to
perform accelerated test of Sn whisker growth are crucial reliability issues in the electronic …
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