Structure and properties of lead-free solders bearing micro and nano particles
L Zhang, KN Tu - Materials Science and Engineering: R: Reports, 2014 - Elsevier
Composite lead-free solders, containing micro and nano particles, have been widely
studied. Due to grain boundary drag or Zener drag, these particles can refrain the solder
microstructure from coarsening in services, especially for Cu 6 Sn 5, Ag 3 Sn intermetallic
compounds and the β-Sn phases. Due to dispersion hardening or dislocation drag, the
mechanical properties of the composite solder alloys were enhanced significantly.
Moreover, these particles can influence the rate of interfacial reactions, and some particles …
studied. Due to grain boundary drag or Zener drag, these particles can refrain the solder
microstructure from coarsening in services, especially for Cu 6 Sn 5, Ag 3 Sn intermetallic
compounds and the β-Sn phases. Due to dispersion hardening or dislocation drag, the
mechanical properties of the composite solder alloys were enhanced significantly.
Moreover, these particles can influence the rate of interfacial reactions, and some particles …
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