Electrochemical micromachining (ECMM) is a promising and economical process that can machine hard-to-machine metals with high material removal rate and good surface integrity. In this work, an attempt has been made to develop a novel atomized electrolyte flushing technique to enhance mass transport. An atomizer is employed for supplying pressurized micro-droplets of electrolyte on the workpiece surface which leads to the formation of a thin and mobile fluid film. This thin film of electrolyte, moving with a high velocity helps in overcoming the problems associated with jet flushing such as radial overcut, stray corrosion, and usage of a large volume of electrolyte for machining. Numerical simulations of atomized electrolyte-based ECMM are carried out by considering a thin electrolyte film in the interelectrode gap to predict the evolution of anode profile on SS304 workpiece. Experimental observations suggest that in comparison with jet electrolyte flushing, the average dimple diameter reduced by 13% and the average dimple depth increased by 52.3% in case of atomized electrolyte flushing at an applied potential of 6 V and electrolyte conductivity of 1.5 S m− 1. It is concluded that the consumption of electrolyte decreases significantly and the localization of dissolution zone improves which ultimately enhances machining performance.