The essential functionality of photonic and electronic devices is contained in thin surface
layers leaving the substrate often to play primarily a mechanical role. Layer transfer of
optimised devices or materials and their heterogeneous integration is thus a very attractive
strategy to realise high performance, low-cost circuits for a wide variety of new applications.
Additionally, new device configurations can be achieved that could not otherwise be
realised. A range of layer transfer methods have been developed over the years including …