Investigation of various board-level underfills and adhesives for CTBGA bend performance enhancements in lead-free portable electronic products
H Shi, T Ueda - … on Electronic Packaging Technology and High …, 2011 - ieeexplore.ieee.org
This paper discusses the influences of various underfills and adhesives on board-level bend
performance of ChipArray® Thin Core Ball Grid Array (CTBGA) assemblies through an the …
performance of ChipArray® Thin Core Ball Grid Array (CTBGA) assemblies through an the …
Study on the bend performance of package stackable very thin fine pitch ball grid array assemblies with edge and corner bond adhesives
H Shi, T Ueda - 2011 3rd International Conference on …, 2011 - ieeexplore.ieee.org
This paper presents the four-point bend test results for edge and corner bonded 0.5 mm
pitch lead-free package stackable very thin fine pitch ball grid arrays (PSvfBGAs) as …
pitch lead-free package stackable very thin fine pitch ball grid arrays (PSvfBGAs) as …
Underfilled BGAs for a variety of plastic BGA package types and the impact on board-level reliability
T Burnette, Z Johnson, T Koschmieder… - … Conference (Cat. No …, 2001 - ieeexplore.ieee.org
There are continuous efforts in the electronics industry to reduce electronic package size.
The main force pushing for smaller package size is the desire by original equipment …
The main force pushing for smaller package size is the desire by original equipment …
Thermal cycling reliability of lead-free package stackable very thin fine pitch ball grid array assemblies with reworkable edge and corner bond adhesives
H Shi, T Ueda - … on Electronic Packaging Technology and High …, 2011 - ieeexplore.ieee.org
This paper presents the thermal cycling test results for edge and corner bonded 0.5 mm
pitch lead-free package stackable very thin fine pitch ball grid arrays (PSvfBGAs) as …
pitch lead-free package stackable very thin fine pitch ball grid arrays (PSvfBGAs) as …
Experiment and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending
This paper presents the four-point bend test results for edge and corner bonded 0.5 mm
pitch lead-free package stackable very thin fine pitch ball grid arrays (PSvfBGAs) as …
pitch lead-free package stackable very thin fine pitch ball grid arrays (PSvfBGAs) as …
Reliability of ball grid array (BGA) assembly with reworkable capillary underfill material
H Fu, Z Ding, Y Ding, F Qi - 2005 6th International conference …, 2005 - ieeexplore.ieee.org
In this paper, the reliability of the BGA assembly with underfill material is studied by three-
point bend test, mechanical bending fatigue test and thermal fatigue test. With the rapid …
point bend test, mechanical bending fatigue test and thermal fatigue test. With the rapid …
Thermal behavior analysis of lead-free flip-chip ball grid array packages with different underfill material properties
H Chen, K Hsu, T Lin, J Leu - 2008 International Conference on …, 2008 - ieeexplore.ieee.org
Low-k materials have been introduced in the backend interconnects since 90 nm node for
advanced microelectronic products in order to reduce the RC delay. However, the fragile low …
advanced microelectronic products in order to reduce the RC delay. However, the fragile low …
Systematic studies of second level interconnection reliability of edge and corner bonded lead-free array-based packages under mechanical and thermal loading
H Shi, D Yu, T Ueda - 2012 IEEE 62nd Electronic Components …, 2012 - ieeexplore.ieee.org
Lead-free (LF) solder joints of portable devices are frequently subjected to unintentional
drop, bend, shear and thermal cycling loading during transportation, handling, and usage …
drop, bend, shear and thermal cycling loading during transportation, handling, and usage …
[PDF][PDF] Validated test method to characterize and quantify pad cratering under BGA pads on printed circuit boards
M Ahmad, J Burlingame, C Guirguis - Proceedings of APEX Expo, 2009 - ipc.org
The conversion to lead free Ball Grid Array (BGA) packages has raised several new
assembly and reliability issues. One reliability concern becoming more prevalent is the …
assembly and reliability issues. One reliability concern becoming more prevalent is the …
Effects of edge and corner bond adhesives on the drop reliability of package-on-package bottom package assemblies
H Shi, T Ueda - 2011 3rd International Conference on …, 2011 - ieeexplore.ieee.org
This paper presents the drop test results for edge and corner bonded 0.5 mm pitch lead-free
package stackable very thin fine pitch ball grid arrays (PSvfBGAs) as package-on-package …
package stackable very thin fine pitch ball grid arrays (PSvfBGAs) as package-on-package …