In this paper, the finite volume method (FVM) is used for the simulation of flip chip underfill
process by considering non-Newtonian flow between two parallel plates that emulate the …

Two parallel plates with a dimension of 5mm× 5mm and various gap heights (5, 10, 15, 20,
25, 30, and 35μm) are simulated using a finite volume method-based software. A three …

Underfill process is a critical manufacturing process to safeguard and enhance the package
reliability of flip-chip devices. In most underfill researches, the underfill flow was primarily …

In this paper, the finite volume method (FVM) based numerical simulation is used for the flow
visualization of capillary driven underfill process for different solder bump arrangements of …

The flip chip process involves the deposition of solder bumps on the chip surface and their
subsequent direct attachment and connection to a substrate. Underfilling traditional flip chip …

Flip chip package is the most important technology in IC package necessary for scale,
velocity and cost by the development of semiconductor technology and the innovation of …

Underfill is typically applied in flip chips to increase the reliability of the electronic
packagings. In this paper, the evolution of the melt-front shape of the capillary-driven …

Underfill is an important process in flip-chip encapsulation because of its great impact on the
reliability of the electronic packagings. This paper focuses on the study of the fluid flow in …

This study provides an in-depth simulation of the capillary underfill (CUF) process for flip-
chip packages using Moldex3D, offering a comprehensive analysis that integrates material …

Three distinct flip-chip underfill cases were considered in this work, with each possess a
bump pitch of 0.8 mm, 1.0 mm and 1.2 mm. Contact line jump (CLJ) phenomenon during the …