Underfill is typically applied in flip chips to increase the reliability of the electronic
packagings. In this paper, the evolution of the melt-front shape of the capillary-driven …

Underfill process is a very important step in the flip-chip packaging because of its great
impact on the reliability of electronic devices. In the control of the underfill dispensing in flip …

Underfill is an important process in flip-chip encapsulation because of its great impact on the
reliability of the electronic packagings. This paper focuses on the study of the fluid flow in …

In recent years, flip-chip packaging technology has been regarded as one of the most
promising interconnect methods because of the superior electrical performance such as the …

Underfill is applied to fill the gap between the silicon chip and the organic substrate of the
flip-chip to enhance its thermal-mechanical reliability. This paper focus on the traditional …

This paper presents a new analytical filling time model to predict the flow of non-Newtonian
underfill fluid during flip-chip encapsulation process. The current model is formulated based …

Underfill, mainly composed of epoxy resin and silica fillers, is used to fill the standoff gap in
flip chip to alleviate stress and prevent the solder bumps from crack and fatigue fracture. In …

During the capillary underfill (CUF) process in flip-chip packaging, issues like incomplete
filling, voids, wire sweeping, and overflow can impact product reliability and the relatively …

The scope of review of this paper focused on the precuring underfilling flow stage of
encapsulation process. A total of 80 related works has been reviewed and being classified …

We developed a numerical method for simulating the underfill flow of conventional capillary
flow and no-flow types in flip-chip packaging. The analytical models for the two types of …