Despite the contact angle of underfill fluid is largely correlated to the flowability, it was
scarcely being investigated in the design optimization of flip-chip underfill encapsulation …

Purpose The purpose of the study is to investigate the spatial aspects of underfill flow during
the flip-chip encapsulation process, for instance, meniscus evolution and contact line jump …

Purpose This paper aims to study the filling progression of underfill flow and void formation
during the flip-chip encapsulation process. Design/methodology/approach A new parameter …

Underfill process is a critical manufacturing process to safeguard and enhance the package
reliability of flip-chip devices. In most underfill researches, the underfill flow was primarily …

The scope of review of this paper focused on the precuring underfilling flow stage of
encapsulation process. A total of 80 related works has been reviewed and being classified …

We developed a numerical method for simulating the underfill flow of conventional capillary
flow and no-flow types in flip-chip packaging. The analytical models for the two types of …

Underfill is typically applied in flip chips to increase the reliability of the electronic
packagings. In this paper, the evolution of the melt-front shape of the capillary-driven …

Three distinct flip-chip underfill cases were considered in this work, with each possess a
bump pitch of 0.8 mm, 1.0 mm and 1.2 mm. Contact line jump (CLJ) phenomenon during the …

This paper presents a new analytical filling time model to predict the flow of non-Newtonian
underfill fluid during flip-chip encapsulation process. The current model is formulated based …

Underfill, mainly composed of epoxy resin and silica fillers, is used to fill the standoff gap in
flip chip to alleviate stress and prevent the solder bumps from crack and fatigue fracture. In …