Underfill process is a critical manufacturing process to safeguard and enhance the package
reliability of flip-chip devices. In most underfill researches, the underfill flow was primarily …

In this paper, the finite volume method (FVM) is used for the simulation of flip chip underfill
process by considering non-Newtonian flow between two parallel plates that emulate the …

Underfill is an important process in flip-chip encapsulation because of its great impact on the
reliability of the electronic packagings. This paper focuses on the study of the fluid flow in …

Purpose This paper aims to present new analytical model for the filling times prediction in
flip-chip underfill encapsulation process that is based on the surface energetic for post-bump …

Purpose The purpose of the study is to investigate the spatial aspects of underfill flow during
the flip-chip encapsulation process, for instance, meniscus evolution and contact line jump …

The scope of review of this paper focused on the precuring underfilling flow stage of
encapsulation process. A total of 80 related works has been reviewed and being classified …

Three distinct flip-chip underfill cases were considered in this work, with each possess a
bump pitch of 0.8 mm, 1.0 mm and 1.2 mm. Contact line jump (CLJ) phenomenon during the …

Underfill, mainly composed of epoxy resin and silica fillers, is used to fill the standoff gap in
flip chip to alleviate stress and prevent the solder bumps from crack and fatigue fracture. In …

Semiconductor industry is the leader of industries in Taiwan for more than ten years. The
development of microchip product is pretty complicated due to the complexity of material …

Underfill is typically applied in flip chips to increase the reliability of the electronic
packagings. In this paper, the evolution of the melt-front shape of the capillary-driven …