Purpose This paper aims to present new analytical model for the filling times prediction in
flip-chip underfill encapsulation process that is based on the surface energetic for post-bump …

Purpose This paper aims to study the filling progression of underfill flow and void formation
during the flip-chip encapsulation process. Design/methodology/approach A new parameter …

The scope of review of this paper focused on the precuring underfilling flow stage of
encapsulation process. A total of 80 related works has been reviewed and being classified …

Purpose This paper aims to introduce a new indicative parameter of filling efficiency to
quantify the performance and productivity of the flip-chip underfill encapsulation process …

Underfill encapsulation process regularly encounters productivity issue of long filling time
that incurs additional manufacturing costs. The package was optimized to attain least filling …

Underfill process is a critical manufacturing process to safeguard and enhance the package
reliability of flip-chip devices. In most underfill researches, the underfill flow was primarily …

This paper presents a new analytical filling time model to predict the flow of non-Newtonian
underfill fluid during flip-chip encapsulation process. The current model is formulated based …

This paper presents a new approach to formulating an analytical model for the underfill
process in flip-chip packaging to predict the flow front and the filling time. The new approach …

Consistent with the recent trends in which the flip-chip reliability and performance being
prominently prioritized, this paper is devoted to study the effects of solder bump shapes on …

Purpose The purpose of the study is to investigate the spatial aspects of underfill flow during
the flip-chip encapsulation process, for instance, meniscus evolution and contact line jump …