3D-stacked DRAM alleviates the limited memory bandwidth bottleneck that exists in modern
systems by leveraging through silicon vias (TSVs) to deliver higher external memory …

Memory bandwidth has become a major performance bottleneck as more and more cores
are integrated onto a single die, demanding more and more data from the system memory …

Three-dimensional integration enables stacking memory directly on top of a microprocessor,
thereby significantly reducing wire delay between the two. Previous studies have examined …

3D-integration is a promising technology to help combat the" Memory Wall" in future multi-
core processors. Past work has considered using 3D-stacked DRAM as a large last-level …

3D multicore systems with stacked DRAM have the potential to boost system performance
significantly; however, this performance increase may cause 3D systems to exceed the …

Poor DRAM technology scaling over the course of many years has caused DRAM-based
main memory to increasingly become a larger system bottleneck. A major reason for the …

Editor's note: From a system architecture perspective, 3D technology can satisfy the high
memory bandwidth demands that future multicore/manycore architectures require. This …

Emerging 3D die-stacked DRAM technology is one of the most promising solutions for future
memory architectures to satisfy the ever-increasing demands on performance, power, and …

First defined two decades ago, the memory wall remains a fundamental limitation to system
performance. Recent innovations in 3D-stacking technology enable DRAM devices with …

Modern computing systems suffer from the dichotomy between computation on one side,
which is performed only in the processor (and accelerators), and data storage/movement on …