The scope of review of this paper focused on the precuring underfilling flow stage of
encapsulation process. A total of 80 related works has been reviewed and being classified …

Purpose The purpose of the study is to investigate the spatial aspects of underfill flow during
the flip-chip encapsulation process, for instance, meniscus evolution and contact line jump …

Consistent with the recent trends in which the flip-chip reliability and performance being
prominently prioritized, this paper is devoted to study the effects of solder bump shapes on …

Underfill process is a very important step in the flip-chip packaging because of its great
impact on the reliability of electronic devices. In the control of the underfill dispensing in flip …

This paper presents a new analytical filling time model to predict the flow of non-Newtonian
underfill fluid during flip-chip encapsulation process. The current model is formulated based …

This article describes an analytical model for the prediction of the underfill flow
characteristics in a flip-chip package driven by capillary action. In this model, we consider …

We developed a numerical method for simulating the underfill flow of conventional capillary
flow and no-flow types in flip-chip packaging. The analytical models for the two types of …

Underfill encapsulation process regularly encounters productivity issue of long filling time
that incurs additional manufacturing costs. The package was optimized to attain least filling …

In this paper, the flow of encapsulant during the underfill encapsulation of flip-chips has
been studied. Analytical as well as numerical methods have been developed to analyze the …

Capillary Underfill (CUF) process has been widely used in flip-chip packaging since it offers
significant improvement of the solder joint reliability. This study focuses on the underfill flow …