Three distinct flip-chip underfill cases were considered in this work, with each possess a
bump pitch of 0.8 mm, 1.0 mm and 1.2 mm. Contact line jump (CLJ) phenomenon during the …

Purpose The purpose of the study is to investigate the spatial aspects of underfill flow during
the flip-chip encapsulation process, for instance, meniscus evolution and contact line jump …

Underfill process is a critical manufacturing process to safeguard and enhance the package
reliability of flip-chip devices. In most underfill researches, the underfill flow was primarily …

Underfill, mainly composed of epoxy resin and silica fillers, is used to fill the standoff gap in
flip chip to alleviate stress and prevent the solder bumps from crack and fatigue fracture. In …

Despite the contact angle of underfill fluid is largely correlated to the flowability, it was
scarcely being investigated in the design optimization of flip-chip underfill encapsulation …

In this paper, the finite volume method (FVM) is used for the simulation of flip chip underfill
process by considering non-Newtonian flow between two parallel plates that emulate the …

The flip chip process involves the deposition of solder bumps on the chip surface and their
subsequent direct attachment and connection to a substrate. Underfilling traditional flip chip …

Underfill is applied to fill the gap between the silicon chip and the organic substrate of the
flip-chip to enhance its thermal-mechanical reliability. This paper focus on the traditional …

The flip chip molding is much smaller than a traditional carrier-based system; the chip sits
directly on the circuit board, and is much smaller than the carrier both in area and height …

The scope of review of this paper focused on the precuring underfilling flow stage of
encapsulation process. A total of 80 related works has been reviewed and being classified …