Underfill is an important process in flip-chip encapsulation because of its great impact on the
reliability of the electronic packagings. This paper focuses on the study of the fluid flow in …

Underfill is typically applied in flip chips to increase the reliability of the electronic
packagings. In this paper, the evolution of the melt-front shape of the capillary-driven …

We developed a numerical method for simulating the underfill flow of conventional capillary
flow and no-flow types in flip-chip packaging. The analytical models for the two types of …

Underfill process is a critical manufacturing process to safeguard and enhance the package
reliability of flip-chip devices. In most underfill researches, the underfill flow was primarily …

This paper presents a new analytical filling time model to predict the flow of non-Newtonian
underfill fluid during flip-chip encapsulation process. The current model is formulated based …

Underfill is applied to fill the gap between the silicon chip and the organic substrate of the
flip-chip to enhance its thermal-mechanical reliability. This paper focus on the traditional …

In this paper, the finite volume method (FVM) based numerical simulation is used for the flow
visualization of capillary driven underfill process for different solder bump arrangements of …

The scope of review of this paper focused on the precuring underfilling flow stage of
encapsulation process. A total of 80 related works has been reviewed and being classified …

Underfill, mainly composed of epoxy resin and silica fillers, is used to fill the standoff gap in
flip chip to alleviate stress and prevent the solder bumps from crack and fatigue fracture. In …

In this paper, the flow of encapsulant during the underfill encapsulation of flip-chips has
been studied. Analytical as well as numerical methods have been developed to analyze the …