Advances in wide-bandgap semiconductor devices have increased the allowable operating
temperature of power electronic systems. High-temperature devices can benefit applications …

Transient liquid phase (TLP) bonding is an advanced die-attach technique for wide-
bandgap power semiconductor and high-temperature packaging. TLP bonding advances …

Transient liquid phase (TLP) die-attach bonding is an attractive technique for high-
temperature semiconductor device packaging. In this paper, the material reliability of gold …

Transient liquid phase (TLP) bonding is a promising advanced die-attach technique for wide-
bandgap power semiconductor and high-temperature packaging. TLP bonding advances …

Semiconductor die-attach techniques are critically important in the implementation of high-
temperature wide-bandgap power devices. In this paper, thermal and mechanical …

Power electronics packages typically comprise a dielectric substrate bonded to a metal layer
and attached to heat sinks using a low-thermal-conductivity solder. These multiple layers …

Power electronics modules in electric vehicles and hybrid electric vehicles, particularly those
containing next-generation power semiconductor devices such as silicon carbide and …

The emergence of wide-bandgap (WBG) devices in power electronics packages has
brought significant attention to the reliability and thermal performance of the bonded …

The potential of transient liquid-phase (TLP) bonding for chip packaging applications has
been evaluated, focusing on three interlayer arrangements (Ag-Sn-Ag, Ni-Sn-Ni, and Ag-Sn …

Transient liquid phase (TLP) bonding is a promising solution for high temperature (HT)
electronic devices as high-quality bonds can be formed at a temperature much lower than …