[图书][B] Multiscale Modeling of Mechanical Shock Behavior of Environmentally-Benign Lead-Free Solders in Electronic Packaging
H Fei - 2011 - search.proquest.com
With the increasing focus on developing environmentally benign electronic packages, lead-
free solder alloys have received a great deal of attention. Mishandling of packages, during …
free solder alloys have received a great deal of attention. Mishandling of packages, during …
Multiscale Modeling of Mechanical Shock Behavior of Environmentally-Benign Lead-Free Solders in Electronic Packaging
H Fei - Ph. D. Thesis, 2011 - ui.adsabs.harvard.edu
With the increasing focus on developing environmentally benign electronic packages, lead-
free solder alloys have received a great deal of attention. Mishandling of packages, during …
free solder alloys have received a great deal of attention. Mishandling of packages, during …
Multiscale modeling of mechanical shock behavior of environmentally-benign lead-free solders in electronic packaging
H Fei - 2011 - keep.lib.asu.edu
With the increasing focus on developing environmentally benign electronic packages, lead-
free solder alloys have received a great deal of attention. Mishandling of packages, during …
free solder alloys have received a great deal of attention. Mishandling of packages, during …
[PDF][PDF] Multiscale Modeling of Mechanical Shock Behavior of Environmentally-Benign Lead-Free Solders in Electronic Packaging
H Fei - 2011 - core.ac.uk
With the increasing focus on developing environmentally benign electronic packages, lead-
free solder alloys have received a great deal of attention. Mishandling of packages, during …
free solder alloys have received a great deal of attention. Mishandling of packages, during …