Method of constructing a semiconductor device and structure

Z Or-Bach, DC Sekar, B Cronquist, I Beinglass… - US Patent …, 2012 - Google Patents
2011-12-06 Assigned to MONOLITHIC 3D INC. reassignment MONOLITHIC 3D INC.
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …
被引用次数：301 相关文章 所有 4 个版本

Method for fabrication of a semiconductor device and structure

Z Or-Bach, DC Sekar, B Cronquist, I Beinglass… - US Patent …, 2011 - Google Patents
2020-10-20 Assigned to MONOLITHIC 3D INC. reassignment MONOLITHIC 3D INC.
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …
被引用次数：102 相关文章 所有 2 个版本

Semiconductor device and structure

Z Or-Bach, B Cronquist, I Beinglass, JL De Jong… - US Patent …, 2013 - Google Patents
2011-03-25 Assigned to MONOLITHIC 3D INC. reassignment MONOLITHIC 3D INC.
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …
被引用次数：132 相关文章 所有 2 个版本

System comprising a semiconductor device and structure

Z Or-Bach, B Cronquist, I Beinglass, JL De Jong… - US Patent …, 2012 - Google Patents
2020-10-20 Assigned to MONOLITHIC 3D INC. reassignment MONOLITHIC 3D INC.
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …
被引用次数：74 相关文章 所有 4 个版本

Semiconductor system and device

Z Or-Bach, D Sekar, B Cronquist, Z Wurman - US Patent 9,219,005, 2015 - Google Patents
US9219005B2 - Semiconductor system and device - Google Patents US9219005B2 -
Semiconductor system and device - Google Patents Semiconductor system and device …
被引用次数：108 相关文章 所有 4 个版本

Monolithic three-dimensional semiconductor device and structure

Z Or-Bach, B Cronquist, I Beinglass, JL De Jong… - US Patent …, 2014 - Google Patents
US8754533B2 - Monolithic three-dimensional semiconductor device and structure - Google
Patents US8754533B2 - Monolithic three-dimensional semiconductor device and structure …
被引用次数：81 相关文章 所有 4 个版本

Method of forming three dimensional integrated circuit devices using layer transfer technique

Z Or-Bach, D Sekar, B Cronquist, Z Wurman - US Patent 8,642,416, 2014 - Google Patents
US8642416B2 - Method of forming three dimensional integrated circuit devices using layer
transfer technique - Google Patents US8642416B2 - Method of forming three dimensional …
被引用次数：156 相关文章 所有 4 个版本
[PDF] googleapis.com

Three-dimensional semiconductor structure and method for fabrication thereof

H Yang, TW Dyer - US Patent App. 11/469,098, 2008 - Google Patents
SUMMARY OF THE INVENTION 0013 The invention includes a three-dimensional semi
conductor structure (ie, an integrated circuit) and a method for fabricating the three …
被引用次数：195 相关文章 所有 2 个版本
[PDF] googleapis.com

Method of making a stacked 3D integrated circuit structure

GJ Leedy - US Patent 5,654,220, 1997 - Google Patents
US5654220A - Method of making a stacked 3D integrated circuit structure - Google Patents
US5654220A - Method of making a stacked 3D integrated circuit structure - Google Patents …
被引用次数：131 相关文章 所有 2 个版本
[PDF] googleapis.com

Three-dimensional integrated circuit structure

SY Lee - US Patent 8,367,524, 2013 - Google Patents
Related US Application Data now abandoned, and a continuation-in-part of applica tion No.
1 1/378,059, filed on Mar. 17, 2006, and a continuation-in-part of application No. 1 …
被引用次数：233 相关文章 所有 4 个版本