The efficiency of multijunction solar cells used in concentrated photovoltaic systems is
limited by shading from the grid line top electrode and electrical losses in the top epilayers …

The impact of via etching on triple junction solar cell performance has been investigated for
through cell via contact architectures. Triple junction solar cells with standard top and back …

There is growing interest in using through cell via contacts (TCVC) to replace conventional
grid-line and busbar top contacts on multijunction solar cells (MJSCs) to increase the cell …

Photovoltaic cells are conventionally electrically isolated (isolation) and then separated from
the wafer (singulation) by saw dicing at the end of the fabrication process. However, saw …

In this paper, we present a complete microfabrication process for III-V/Ge triple junction solar
cells with through cell via contacts. This architecture enables the transfer of the front side …

The Solar cell front side is a key design point for improved cell efficiency as a trade is made
between optical losses (shadowing effect) and electrical losses (resistance). One solution …

In this paper, the impact of the plasma process for III-V/Ge heterostructure etching on both
the morphology and the photovoltaic performance is investigated for the fabrication of …

Observing the PV market today, we are faced with two major technologies: traditional
multicrystalline Si-based cells and thin-film PV cells. Multicrystalline Si-based cells have …

In this study we quantify the possible gains in cell performance obtained with an architecture
based on through-cell via contacts (TCVC). We review how the front metallization of solar …

Microfabrication cycles of III‐V multijunction solar cells include several technological steps
and end with a wafer dicing step to separate individual cells. This step introduces damage at …