To protect electronic devices and batteries from sharp temperature rise and thermal
runaway, active/passive/hybrid thermal management using phase change materials (PCMs) …

Recent technological advancements have led to a drastic increase in heat flux dissipation,
which is a prime factor for lower efficiency and permanent failure. Therefore, cooling …

Continued miniaturization and demand for high-end performance of electronic devices and
appliances have led to dramatic increase in their heat flux generation. Consequently …

A diverse spectrum of technology drivers such as improved thermal barriers, higher
efficiency thermoelectric energy conversion, phase-change memory, heat-assisted magnetic …

" This book is a comprehensive text for the design of safety critical, hard real-time embedded
systems. It offers a splendid example for the balanced, integrated treatment of systems and …

Owing to enormously high surface area and high thermal conductivity, copper foam based
heat sinks for electronic cooling are investigated in this paper. Copper foam1 with porosity …

The rapid growth of the electronics industry and the increase in processor power levels
requires new techniques to improve the heat transfer rate in their cooling systems. In this …

The present trend of miniaturization in various electronic devices has caused higher heat
generation per unit area. Dissipation of highly concentrated heat from these devices is …

The ever-increasing performance of thin portable electronic products has made their heat
dissipation issues more and more severe, or even become failure. A novel 0.5 mm thick ultra …

To solve the increasingly serious thermal management problem of chips with multi-cores
and high power density in the three-dimensional integrated circuit (3D-IC), a model of 3D-IC …