Plasma etching, chemical-mechanical polishing (CMP) and chemical wet cleaning of porous SiOCH low-k materials have been shown to negatively impact its insulating properties. In …
M Darnon, N Posseme, T Chevolleau… - MRS Online …, 2014 - cambridge.org
To improve the integrated circuits' performance and continue the downscaling of dimensions, it is necessary to use low dielectric constant materials as interconnects …