Contribution of molecular simulation to the characterization of porous low-k materials
Contribution of molecular simulation to the characterization of porous low-k materials Page 1
Contribution of Molecular Simulation to the characterization of porous low-k materials Lucile …
Contribution of Molecular Simulation to the characterization of porous low-k materials Lucile …
[PDF][PDF] Comparative study of restoration processes for plasma and CMP-damaged low-k materials used in 28 nm CMOS interconnections
M Lépinay, L Broussous, K Courouble, G Imbert… - researchgate.net
Plasma etching, chemical-mechanical polishing (CMP) and chemical wet cleaning of porous
SiOCH low-k materials have been shown to negatively impact its insulating properties. In …
SiOCH low-k materials have been shown to negatively impact its insulating properties. In …
Prospects for dielectric constant reduction in integrated circuits interconnects
To improve the integrated circuits' performance and continue the downscaling of
dimensions, it is necessary to use low dielectric constant materials as interconnects …
dimensions, it is necessary to use low dielectric constant materials as interconnects …