D Bonart - US Patent 10,297,583, 2019 - Google Patents
An embodiment of the present invention describes a method for forming a doped region at a first major surface of a semiconductor substrate where the first doped region being part of a …
L Li, L Viswanathan, JK Jones - US Patent 11,830,842, 2023 - Google Patents
A device assembly includes a functional substrate having one or more electronic components formed there. The functional substrate has a cavity extending from a first …