Temporary bonding/debonding (TBDB) technologies have greatly contributed to the reliable
fabrication of thin devices. However, the rapid development of large-scale, high-precision …

Due to the advantages of non‐contact processing, high efficiency, high precision, and
superior controllability, laser lift‐off (LLO) technologies exhibit excellent material applicability …

Fabricating large-area thin-film flexible electronics rely on the peeling process from rigid
prefabricated carriers. The well-established laser lift-off (LLO) employs a shaped excimer …

Fabricating flexible electronics on plastic is often limited by the poor dimensional stability of
polymer substrates. To mitigate, glass carriers are used during fabrication, but removing the …

Laser debonding offers several advantages such as precision, speed, minimal damage, and
being noncontact. We investigated the feasibility of utilizing laser processing technology in …

The influence of the picosecond (ps) pulsed burst with a nanosecond scale of temporal
separation (50 ns) on filamentary traces in sapphire substrate is investigated. The …

Two-dimensionally scalable vertical cavity surface emitting laser (VCSEL) emitter of size 30
mm× 30 mm was designed and fabricated for practical applications in the rapid heating …

随着5G, 人工智能和物联网等新基建的逐步完善, 单纯依靠缩小工艺尺寸来提升芯片功能和性能
的方法已经难以适应未来集成电路产业发展的需求. 为满足集成电路的多功能化及产品的多元化 …

Fabricating flexible electronics on plastic is often limited by the poor dimensional stability of
polymer substrates. To mitigate, glass carriers are used during fabrication, but removing the …

Laser debonding offers several advantages such as precision, speed, minimal damage, and
non-contact. We investigated the feasibility of utilizing laser processing technology in …