H Fan, P Yao, H Chen - 2023 24th International Conference on …, 2023 - ieeexplore.ieee.org
The design of power packages with both high efficiency and high-power density performance while maintaining the highest possible reliability is a challenge. During …
C Yuan, SDM de Jong… - 2024 25th International …, 2024 - ieeexplore.ieee.org
The demand for rapid advancement in AI, mobile and automotive markets is pushing the boundaries of electronic packaging, including heterogeneous integration, high-power …