Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of
LEDs typically on a Sub strate. Pedestals are deposited on the LEDs with each of the …

Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of
LEDs typically on a sub strate. Pedestals are deposited on the LEDs with each of the …

Methods for fabricating light emitting diode (LED) chips one of which comprises flip-chip
mounting a plurality of LEDs on a surface of a submount wafer and forming a coating over …

S S. sNN NëN and is converted. The first conversion material emission spec trum does not
substantially overlap with the second conver sion material excitation spectrum. Methods …

US8556672B2 - Method of producing light-emitting device and light-emitting device - Google
Patents US8556672B2 - Method of producing light-emitting device and light-emitting device …

HOIL 33/54(2010.01)(52) US Cl.(57) ABSTRACT CPC.............. HOIL 33/508 (2013.01); HOIL
33/44 Methods are disclosed including applying a conformal coat ing to multiple light …

(57) ABSTRACT A light emitter device, package, or lamp that comprises and light emitter
and a light transmission control material to mask the appearance of at least the light emitter …

This invention is directed to offer a package type semicon ductor device that can realize a
smaller siZe device and its manufacturing method as Well as a small stacked layer type …

Methods for fabricating semiconductor devices such as LED chips at the wafer level, and
LED chips and LED chip wafers fabricated using the methods. An LED chip wafer according …

Methods of manufacturing an imaging device package are provided. In accordance with an
embodiment a sensor die may be coupled to bond pads on a transparent substrate …