A Gumaste, A Kushwaha - US Patent 9,960,878, 2018 - Google Patents
A network capable of being used in a datacenter is described. The network can comprise a set of optical fiber rings, wherein each optical fiber ring carries data traffic on multiple …
AF Graves - US Patent 9,654,849, 2017 - Google Patents
A method includes receiving a first packet payload, and where the first packet payload originates from a first top-of-rack switch (TOR) and receiving a second packet payload …
H Mehrvar - US Patent 10,306,344, 2019 - Google Patents
The present application provides methods of determining bandwidth demands and allocating bandwidth for a network including a plurality of groups of sub-networks. Each …
AS Kaviani, P Maidee, EF Dellinger - US Patent 10,042,806, 2018 - Google Patents
An example programmable integrated circuit (IC) includes a programmable fabric having a programmable interconnect and wire tracks adjacent to at least one edge of the …
PL Tien, MCJ Yuang, R Wei-Zhang, C Chen… - US Patent …, 2020 - Google Patents
An intelligence-defined optical tunnel network system includes multiple Optical Switch Interconnect Sub-systems (OSIS). Any one of the OSIS includes a receiving sub module, an …
G Bottari, A D'errico, L Giorgi - US Patent 10,687,129, 2020 - Google Patents
A data center network node comprising at least one server connection for connecting to a server 6, a connection 7 for connecting the at least one server 6 to a first subnetwork. The …
SA Marshall - US Patent 11,044,539, 2021 - Google Patents
An optical switch plane with one or more switch layers, each layer with multiple switches is provided. In a data center, an optical circuit switch plane is added between the device plane …
YW Ra, Y Kim - US Patent 10,110,977, 2018 - Google Patents
A photonic frame switching system may include a main controller and at least one photonic frame wrapper line card. The main controller may determine a point in time at which a …
AS Kaviani, P Maidee, I Bolsens - US Patent App. 16/891,972, 2022 - Google Patents
An example integrated circuit (IC) system includes a package substrate having a programmable integrated circuit (IC) and a companion IC mounted thereon, the …