(57) ABSTRACT A photonic chip includes a device layer and a port layer, with an optical port
located at the port layer. Inter-layer optical couplers are provided for coupling light between …

The semiconductor module includes a semiconductor chip and a semiconductor chip. The
semiconductor chip includes an optical device such as an optical waveguide, an optical …

Aspects disclosed herein include providing a photonic chip that includes an unetched side
surface formed by a dicing process performed on a semiconductor wafer, and first edge …

An optical integrated circuit device includes a semiconductor substrate and a first waveguide
made of a first material and disposed over the semiconductor substrate. The first waveguide …

The semiconductor module includes a first semiconductor chip and a second semiconductor
chip. The first semiconductor chip includes an optical device such as an optical waveguide …

The next-generation of optoelectronic systems will require efficient optical signal transfer
between many discrete photonic components integrated onto a single substrate. While …

US11567262B2 - End-face coupling structures underneath a photonic layer - Google
Patents US11567262B2 - End-face coupling structures underneath a photonic layer …

The present disclosure provides for laser integration into photonic platforms in which a first
wafer, including a first substrate and a first insulator that includes a first plurality of dies that …

Embodiments herein describe a photonic chip which includes a coupling interface for
evanescently coupling the chip to a waveguide on an external substrate. In one …

US11635568B2 - Photonics light signal transmission - Google Patents US11635568B2 -
Photonics light signal transmission - Google Patents Photonics light signal transmission …