Surface treatment is necessary in a host of industries to attain a defect-free surface. In
medical and semiconductor fields, for example, clean surfaces are essential to provide good …

The fabrication of interconnects in integrated circuits requires the use of porous low
dielectric constant materials that are unfortunately very sensitive to plasma processes. In this …

This work reports on the improved performance using nanoporous organosilicate (SiOCH)
for lab‐on-a-chip extraction of organic pollutants from natural waters. Validations were …

The ultra-violet (UV) and vacuum ultra-violet (VUV) resistance of bridging alkylene groups in
organosilica films has been investigated. Similar to the Si-CH 3 (methyl) bonds, the Si-CH 2 …

Nous présentons dans ce travail l'impact du procédé de fabrication d'un circuit intégré
(nœud technologique 28 nm) sur le matériau diélectrique poreux utilisé pour isoler les …

The integration of porous dielectric (low-k) in interconnects of integrated circuits is limited by
the damage induced by plasma processes to the porous material. Plasma-damaged …

Submilisecond laser anneal has been experimentally investigated for porogen removal and
its ability to improve the mechanical strength in oxycarbosilane ultra low-k films …

Scientists and engineers have available to them powerful qualitative and quantitative
analytical techniques for the analysis of materials. Specifically, ion and electron beam …

2.2. SCOPE This chapter explores the most prominent first level interconnects common in
today's industry namely: wire-bonding, tape automated bonding and flip-chip bonding …

Ultra-low-k (ULK) dielectrics are a class of insulating materials that act to minimize
capacitance in microelectronic circuits. ULKs are distinguished from ordinary low-k …