Embodiments herein describe a photonic chip which includes a coupling interface for
evanescently coupling the chip to a waveguide on an external substrate. In one …

Techniques for forming a facet optical coupler that includes a waveguide formed over a
trench of a silicon substrate are described. The trench is formed in a silicon substrate and …

A facet optical coupler, and techniques for forming a facet optical coupler, that includes a
waveguide disposed in a trench of a substrate are described. The substrate may be a silicon …

Techniques for forming a facet optical coupler that includes a waveguide formed over a
trench of a silicon substrate are described. The trench is formed in a silicon substrate and …

Cantilevered waveguides suspended above an air cavity in an underlying substrate are
described. The waveguide is formed by patterning a waveguide layer in some embodiments …

(57) ABSTRACT A novel germanium (Ge) photodetector is disclosed, contain ing a stripe
layer including Ge, a Substrate Supporting the stripe layer, and P and N regions, which are …

Embodiments herein describe a photonic chip which includes a coupling interface for
evanescently coupling the chip to a waveguide on an external substrate. In one …

An optical waveguide structure including a bottom layer, a middle waveguide layer, and a
top cladding layer is provided. The middle waveguide layer is disposed on the bottom layer …

The disclosed embodiments relate to an integrated circuit structure and methods of forming
them in which photonic devices are formed on the back end of fabricating a CMOS …

US11221447B1 - Suspended cantilever waveguide - Google Patents US11221447B1 -
Suspended cantilever waveguide - Google Patents Suspended cantilever waveguide …