Polymer composites have essential applications in electronics due to their versatility, stable
performance, and processability. However, with the increasing miniaturization and high …

Recently, the need for miniaturization and high integration have steered a strong technical
wave in developing (micro‐) electronic devices. However, excessive amounts of heat may …

Thermally conductive materials (TCMs) are highly desirable for thermal management
applications to tackle the “overheating” concerns in the electronics industry. Despite recent …

For advanced thermal interface materials (TIMs), massive inorganic addition for high
isotropic thermal conductivities conflicts with suitable rheological viscosity for low contact …

Epoxy thermosets have outstanding physical and chemical properties, but they are
unrecyclable/non-degradable due to their permanently cross-linked networks, and are also …

The rapid development of highly integrated microelectronic devices causes urgent demands
for advanced thermally conductive adhesives (TCAs) to solve the interfacial heat‐transfer …

Portable and wearable materials with anti-electromagnetic interference (EMI), effective
thermal management, stability and durability are sought after in the modern electronics …

With the miniaturization of current electronic products, ceramic/polymer composites with
excellent thermal conductivity have attracted increasing attention. For regular ceramic …

Phase change thermal interface materials (PCTIMs) are receiving increasing attention but
suffer from low thermal conductivity and are challenging to improve significantly. Here …

The sharp reduction in size and increase in power density of next‐generation integrated
circuits lead to electromagnetic interference and heat failure being a key roadblock for their …