Compact Heterogeneous Integration for Next Generation High Frequency Scalable Array with...

Integrated photonics packaging: challenges and opportunities

L Ranno, P Gupta, K Gradkowski, R Bernson… - ACS …, 2022 - ACS Publications
Packaging of photonic integrated circuit (PIC) chips is an essential and critical step before
they can be integrated into functional optoelectronic systems. Photonic packaging is …
被引用次数：32 相关文章

Multi Glass-Wafer Stacked Technology for 3D Heterogeneously-Integrated Scalable 6G Arrays

SZ Aslam, O Boomhower, J Popp… - 2024 IEEE Wireless …, 2024 - ieeexplore.ieee.org
This article presents the D-band characterization of General Electric's (GE) high-purity fused-
silica (HPFS) substrate processing using microstrip ring resonator (MRR) and required …
被引用次数：1 相关文章